Scheder, Andre
Andre Scheder, M. Sc.
Department Elektrotechnik-Elektronik-Informationstechnik (EEI)
Lehrstuhl für Hochfrequenztechnik
Cauerstraße 9
91058 Erlangen
- Telefon: +49 9131 85-27219
- Faxnummer: +49 9131 85-27212
- E-Mail: andre.scheder@fau.de
Akademische Ausbildung
- B.Eng. Elektrotechnik von 2014 bis 2017
- M.Sc. Elektrotechnik von 2017 bis 2020
- Doktorand am LHFT seit Oktober 2020
Forschungsgebiete
- 6G Massive-MIMO
- Intelligent Reflective Surface (IRS)
- HF-Messtechnik
- Millimeterwellen Schaltungen und Module
Abschlussarbeiten
Es entstehen regelmäßig neue Themen für Abschlussarbeiten in den oben genannten Fachgebieten.
Neueste Veröffentlichungen
- A. Scheder, N. Zocher and M. Vossiek, "It’s a Match", IEEE Microwave Magazine, vol. 26, pp. 119-126, Mai, 2025.
DOI: 10.1109/MMM.2024.3499977 - C. Karle, M. Neu, B. Nuss, J. Chen, L. Witte, A. Scheder, T. Harbaum and J. Becker, "Modular Hardware Design for High-Performance MIMO-Capable SDR Systems to Accelerate 6G Development", in Proceedings of the 2024 IEEE 37th International System-on-Chip Conference (SOCC), Dresden, November, 2024.
DOI: 10.1109/SOCC62300.2024.10737765 - A. Scheder, L. Witte, J. Rottinghaus, P. Gröschel, C. Karle, M. Neu, B. Nuss and M. Vossiek, "An Advanced Concept for Coherent Ultra-Low Phase-Noise Clock, LO and Trigger Generation & Distribution in 6G Massive-MIMO Systems", in Proceedings of the 2024 54th European Microwave Conference (EuMC), pp. 996-999, Paris, Oktober, 2024.
DOI: 10.23919/EuMC61614.2024.10732511 - T. Kögel, A. Scheder, M. Meyl, S. Sohr and M. Vossiek, "It's Tee Time: An Ultrabroadband Componentless Bias Tee: A Planar Ultrabroadband Componentless Bias Tee in Microstrip Line Technology", IEEE Microwave Magazine, vol. 25, no. 6, pp. 65-71, Juni, 2024.
DOI: 10.1109/MMM.2024.3378613 - A. Scheder, T. Pfahler, A. Bridier and M. Vossiek, "An Ultra-Wideband Microstrip Gain Equalizer on Thin-Film Ceramic for Future Millimeter Wave Applications up to and Beyond 120 GHz", in Proceedings of the 2024 IEEE Wireless and Microwave Technology Conference (WAMICON), Clearwater, Mai, 2024.
DOI: 10.1109/WAMICON60123.2024.10522854 - C. Karle, M. Neu, B. Nuss, L. Witte, A. Scheder, E. Waldner, E. Shkurtaj, T. Harbaum and J. Becker, "Scalable Multi-Level Synchronization Technique of Distributed Multi-RFSoC-Server Systems for 6G", in Proceedings of the International System on Chip Conference, Dresden, 2024.
DOI: 10.1109/SOCC62300.2024.10737777 - A. Scheder, J. Fleischmann, P. Gröschel and M. Vossiek, "Dual Polarized 1-Bit Reconfigurable Reflective Unit Cell Design for Intelligent Reflective Surfaces Operating in the 5.8 GHz ISM Band", in Proceedings of the 2024 54th European Microwave Conference, EuMC 2024, pp. 236-239, Paris, 2024.
DOI: 10.23919/EuMC61614.2024.10732627 - T. Pfahler, A. Scheder, A. Bridier, M. Nagel and M. Vossiek, "A Foil Flip-Chip Interconnect With an Ultra-Broadband Bandwidth of 130 GHz and Beyond for Heterogeneous High-End System Designs", IEEE Journal of Microwaves, vol. 4, no. 3, pp. 404-415, 2024.
DOI: 10.1109/JMW.2024.3406919 - T. Pfahler, A. Scheder, A. Bridier, J. Schür and M. Vossiek, "A Low-Loss Bond-Wire Interconnect Design With More Than 130 GHz Bandwidth Enabling an Ultra-Broadband Heterogeneous System Design", IEEE Transactions on Microwave Theory and Techniques, vol. 72, pp. 505-515, September, 2023.
DOI: 10.1109/TMTT.2023.3314113 - T. Pfahler, A. Scheder, A. Bridier, J. Schür and M. Vossiek, "A Novel Ultra-Broadband Low-Loss Bond-Wire Interconnect Design Concept Applied to a 2 GHz to 135 GHz Substrate-to-Substrate Interface", in Proceedings of the 2023 IEEE/MTT-S International Microwave Symposium - IMS 2023, San Diego, CA, Juli, 2023.
DOI: 10.1109/IMS37964.2023.10188177 - P. Fenske, T. Kögel, A. Scheder, K. Root, C. Carlowitz and M. Vossiek, "An Active Self-Interference Cancellation Coupler with 60 dB Isolation Applied in a 24 GHz SFCW Radar", in Proceedings of the 2023 IEEE/MTT-S International Microwave Symposium - IMS 2023, pp. 517 - 520, San Diego, CA, USA, Juli, 2023.
DOI: 10.1109/IMS37964.2023.10187937 - P. Fenske, A. Scheder, T. Kögel, K. Root, M. Vossiek and C. Carlowitz, "Self-Interference Leakage Estimation 'N' Cancellation Element: Design of an Active Self-Interference Cancellation Coupler", IEEE Microwave Magazine, vol. 24, no. 6, pp. 68-75, Juni, 2023.
DOI: 10.1109/MMM.2023.3256380 - A. Scheder, T. Pfahler, A. Bridier, J. Schür and M. Vossiek, "An Ultra-Wideband DC-Block on Thin-Film Ceramic for the Next Generation of Test and Measurement Applications Up to 150 GHz", in Proceedings of the 2023 53rd European Microwave Conference, EuMC 2023, pp. 46-49, Berlin, DEU, 2023.
DOI: 10.23919/EuMC58039.2023.10290662 - E. Stenglein, A. Scheder, D. Kübrich, M. Albach and T. Dürbaum, "New experimental verification of transformer core saturation occurring in forward converters due to remanence flux density", in Proceedings of the PCIM Europe Conference Proceedings, pp. 2053-2060, Nuremberg, 2019.