Gold, Gerald

Dr.-Ing. Gerald Gold, Akad. Rat

Research Group Leader: Microwave Assembly and Interconnects

Department Elektrotechnik-Elektronik-Informationstechnik (EEI)
Lehrstuhl für Hochfrequenztechnik

Raum: Raum 00.024
Konrad-Zuse-Straße 7
91052 Erlangen

Forschungsschwerpunkte

  • Elektromagnetische Wechselwirkung an nichtidealen Materialübergängen, insbesondere Felder in rauen Metalloberflächen
  • Numerische Feldsimulation
  • 3D-Druck von passiven HF-Komponenten
  • 3D-HF-Aufbau- und Verbindungstechniken
  • Entwurf von temporären HF-Prüfadaptionen, insbesondere mit anisotropen Leitelastomeren
  • Automatisierung von HF-Prüfaufgaben

Positionen und Funktionen

Vita

Scholar profile

Gerald Gold received the Diploma degree in mechatronics and the Dr. Eng. degree from Friedrich-Alexander University Erlangen-Nürnberg (FAU), Erlangen, Germany, in 2009 and 2016, respectively. Since 2010, he is with the the Institute of Microwaves and Photonics, FAU, as a Research Assistant. He became the Group Leader of the Microwave Assembly and Interconnects Group in 2018. His research interests include 3D-printed microwave components, electromagnetic interaction with non-ideal surfaces, and automation of RF-measurements.

Neueste Veröffentlichungen

  • A. Hofmann, L. Klein, K. Lomakin, M. Sippel and G. Gold, "Additively Manufactured WR15 Waveguide to Microstrip Transition for Broadband V-Band Applications", in Proceedings of the European Microwave Conference (EuMC), Milan, Italy, September, 2022.
  • A. Hofmann, K. Lomakin, M. Sippel and G. Gold, "Additively Manufactured Slotted Waveguides for THz Applications", in Proceedings of the IEEE/MTT-S International Microwave Symposium (IMS), Denver, CO, Juni, 2022.
  • L. Engel, K. Lomakin, G. Gold, T. Pfahler, J. Schür and M. Vossiek, "3D Printed Waveguide Transition for 77 GHz Radar Applications", in Proceedings of the Published in: 2022 14th German Microwave Conference (GeMiC), Ulm, Germany, Mai, 2022.
  • A. Hofmann, K. Lomakin, M. Sippel and G. Gold, "Additively Manufactured Broadwall Waveguide Couplers for V-Band Applications", in Proceedings of the German Microwave Conference, Ulm, Mai, 2022.
  • K. Lomakin, S. Alhasson and G. Gold, "3D-Printed Compact Full-E-Band Wavemode Transitions for Direct Launching from IC to Waveguides with minimal Line Length on PCB", in Proceedings of the 22nd IEEE Wireless and Microwave Technology Conference, Clearwater FL, United States, April, 2022.
  • G. Gold and L. Engel, "Typical Offset of Usable Antenna Bandwidth due to Surface Roughness", in Proceedings of the 22nd IEEE Wireless and Microwave Technology Conference (WAMICON), Clearwater Beach, FL, April, 2022.
  • H. Maune, K. Hübner and G. Gold, "Considerations for V- and W-Band Inter-Satellite Links", in Proceedings of the 22nd IEEE Wireless and Microwave Technology Conference (WAMICON), Clearwater Beach, FL, April, 2022.
  • K. Lomakin, S. Alhasson and G. Gold, "Additively Manufactured Amplitude Tapered Slotted Waveguide Array Antenna with Horn Aperture for 77GHz", IEEE Access, März, 2022.
  • D. Panusch, F. Hubert, F. Bachbauer, K. Lomakin and G. Gold, "Additively Manufactured Helix Antenna for X-Band Applications", in Proceedings of the EuCAP 2022 - 16th European Conference on Antennas and Propagation, pp. 1 - 4, Madrid, März, 2022.
  • K. Lomakin, J. Schür and G. Gold, "Design Optimization of Pyramidal Horn Antennas for 3D Printing in the mm-Wave Range", in Proceedings of the 16th European Conference on Antennas and Propagation (EuCAP), Madrid, März, 2022.
  • F. Hubert, T. Bader, L. Wahl, A. Hofmann, K. Lomakin, M. Sippel, N. Travitzky and G. Gold, "Additive Manufactured Waveguide for E-Band Using Ceramic Materials", Applied Sciences, vol. 12, no. 1, Dezember, 2021.
  • T. Pfahler, G. Gold, K. Lomakin, L. Engel, J. Schür and M. Vossiek, "Ultra-Wideband Complex Permittivity Extraction of IC Packaging Materials beyond 100 GHz", in Proceedings of the 2021 IEEE MTT-S International Microwave Symposium, Atlanta, Oktober, 2021.
  • K. Lomakin, L. Engel, J. Fleischmann and G. Gold, "Additively Manufactured Wavemode Transition for Broadband E-Band Applications", in Proceedings of the 2021 IEEE/MTT-S International Microwave Symposium (IMS), Atlanta, GA, Juni, 2021.
  • H. Tesmer, G. Gold, F. Bachbauer, E. Polat, M. Sippel, R. Jakoby, M. Vossiek and H. Maune, "Feasibility of Additively Manufactured Tunable Liquid Crystal Loaded Dielectric Waveguides", IEEE Microwave and Wireless Components Letters, pp. 1-1, Mai, 2021.
  • K. Lomakin, M. Sippel, K. Helmreich and G. Gold, "3D Printed Slotted Waveguide Array Antenna for D-Band Applications", in Proceedings of the 2021 15th European Conference on Antennas and Propagation (EuCAP), Düsseldorf, März, 2021.
  • S. Neermann, J. Franke, M. Sippel, K. Lomakin and G. Gold, "RF Characterization of the Homogeneity of Sintered Micro- And Nanoparticle Silver Inks for Printed Electronics", in Proceedings of the 2021 14th International Congress: Molded Interconnect Devices, MID 2021 - Proceedings, Februar, 2021.
  • L. Wang, K. Lomakin, A. Job, R. Suess-Wolf, G. Gold and J. Franke, "Simulation Assisted Characterization of Attenuation at Microstrip Transmission Lines fabricated by Laser Direct Structuring", in Proceedings of the 2021 14th International Congress: Molded Interconnect Devices, MID 2021 - Proceedings, Virtual, Nurnberg, DEU, Februar, 2021.
  • K. Lomakin, L. Wang, A. Job, R. Süß-Wolf, J. Franke, K. Helmreich and G. Gold, "Additive Manufacturing of Coplanar Transmission Lines on Alumina Substrate up to 24 GHz using Laser Assisted Selective Metallization", in Proceedings of the 2020 50th European Microwave Conference (EuMC), Utrecht, Januar, 2021.
  • L. Klein, K. Lomakin, M. Sippel, K. Helmreich and G. Gold, "Additively Manufactured Six-Port for mmWave Applications", in Proceedings of the 2020 50th European Microwave Conference (EuMC), Utrecht, Januar, 2021.
  • K. Lomakin, L. Klein, M. Sippel, K. Helmreich and G. Gold, "3D-Printed 3 dB Hybrid Coupler for D-Band Applications", in Proceedings of the 2020 50th European Microwave Conference (EuMC), Utrecht, Januar, 2021.
  • S. Neermann, J. Franke, M. Sippel, K. Lomakin and G. Gold, "Reliability of Printed Microwave Electronics", in Proceedings of the IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021), pp. 1791-1796, , ELECTR NETWORK, Januar, 2021.
  • K. Lomakin, L. Klein and G. Gold, "Design and Analysis of 3D Printed Hybrid Couplers for D-Band Applications", International Journal of Microwave and Wireless Technologies, 2021.
  • K. Lomakin, M. Sippel, K. Helmreich and G. Gold, "Design and Analysis of 3D Printed Slotted Waveguides for D-Band using Stereolithography and Electroless Silver Plating", in Proceedings of the 2020 IEEE/MTT-S International Microwave Symposium (IMS), Los Angeles, CA, Juni, 2020.
  • K. Lomakin, K. Helmreich and G. Gold, "Using Group Velocity for Correct Determination of Phase Coefficient Without Initial Phase Assumption", in Proceedings of the 2020 IEEE 24th Workshop on Signal and Power Integrity (SPI), Cologne, Mai, 2020.
  • I. Ullmann, K. Root, K. Lomakin, G. Gold, M. Gottinger, K. Helmreich and M. Vossiek, "Circular Polarization Millimeter-Wave SAR Imaging using 3D-Printed Helix Antennas", in Proceedings of the SPIE Security + Defense Forum, Edingburgh, September, 2020.
  • K. Lomakin, M. Sippel, I. Ullmann, K. Helmreich and G. Gold, "3D Printed Helix Antenna for 77 GHz", in Proceedings of the 2020 14th European Conference on Antennas and Propagation (EuCAP), Copenhagen, Denkmark, März, 2020.
  • G. Gold, "On the Kelvin Transformation in Finite Difference Implementations", Electronics, no. 9, März, 2020.
  • K. Lomakin, S. Herold, L. Ringel, J. Ringel, D. Simon, M. Sippel, A. Sion, M. Vossiek, K. Helmreich and G. Gold, "SLA Printed 3D Waveguide Paths for E-Band using Electroless Silver Plating", IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 9, no. 12, pp. 2476-2481, Dezember, 2019.
  • K. Lomakin, R. Guschlbauer, F. Osmanlic, Z. Fu, M. Sippel, K. Helmreich, C. Körner, M. Vossiek and G. Gold, "3D Printed Copper Waveguides by Selective Electron Beam Melting Process for E-Band", in Proceedings of the EuMW 2019, Paris, Oktober, 2019.
  • M. Sippel, K. Lomakin, M. Ankenbrand, M. Petersen, J. Franke, K. Helmreich, M. Vossiek and G. Gold, "3D-Printed Bowtie Filter Created by High Precision NanoJet System Combined with Novel Printing Strategy", in Proceedings of the 28th Conference on Electrical Performance of Electronic Packages and Systems (EPEPS 2019), Montreal, Oktober, 2019.
  • F. Distler, M. Sippel, J. Schür, G. Gold, K. Helmreich and M. Vossiek, "Additively Manufactured Dielectric Waveguides for Advanced Concepts for Millimeter-Wave Interconnects", IEEE Transactions on Microwave Theory and Techniques, vol. 67, no. 11, pp. 4298-4307, September, 2019.
  • K. Lomakin, L. Klein, L. Ringel, J. Ringel, M. Sippel, K. Helmreich and G. Gold, "3D Printed E-Band Hybrid Coupler", IEEE Microwave and Wireless Components Letters, vol. 29, no. 9, pp. 580-582, September, 2019.
  • I. Lau, A. Hajian, F. Michler, G. Gold, F. Lurz, U. Schmid, K. Helmreich, R. Weigel and A. Kölpin, "Influence of the PCB Manufacturing Process on the Measurement Error of Planar Relative Permittivity Sensors Up To 100 GHz", IEEE Transactions on Microwave Theory and Techniques, vol. 67, no. 7, pp. 2793-2804, Juli, 2019.
  • K. Lomakin, S. Herold, D. Simon, M. Sippel, A. Sion, M. Vossiek, K. Helmreich and G. Gold, "3D Printed Slotted Rectangular Hollow Waveguides", in Proceedings of the IEEE MTT-S International Microwave Symposium, Boston, USA, Juni, 2019., Boston, MA, Juni, 2019.
  • U. Arz et al., "Best Practice Guide for Planar S-Parameter Measurements using Vector Network Analysers : EMPIR - 14IND02 PlanarCal", April, 2019.
  • G. Gold, K. Lomakin, K. Helmreich and U. Arz, "High-Frequency Modeling of Coplanar Waveguides Including Surface Roughness", Advances in Radio Science, no. 17, April, 2019.
  • K. Lomakin, M. Ankenbrand, M. Sippel, J. Franke, K. Helmreich and G. Gold, "Nanojet 3D Printed Coplanar Waveguides on Flexible Polyimide Substrate up to 24 GHz", in Proceedings of the 1st IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS 2019), Glasgow, 2019.
  • K. Lomakin, D. Simon, M. Sippel, G. Gold, K. Helmreich, E. Seler, Z. Tong and R. Reuter, "3D Printed Slotted Waveguide Array Antenna for Automotive Radar Applications in W-Band", in Proceedings of the 48th European Microwave Conference (EuMW 2018), 2018.
  • K. Lomakin, T. Pavlenko, M. Sippel, G. Gold, T. Weidner, K. Helmreich, M. Ankenbrand and J. Franke, "3D Printed Helix Antenna", in Proceedings of the European Conference on Antennas and Propagation (EUCAP), London, GB, 2018.
  • M. Köppel, M. Deckelmann, M. Sippel, K. Lomakin, S. Werzinger, G. Gold, K. Helmreich and B. Schmauß, "Using coherent optical frequency domain reflectometry to assist the additive manufacturing process of structures for radio frequency applications", in Proceedings of the SPIE Optics + Photonics: Optical Engineering + Applications, San Diego, US, 2018.
  • K. Lomakin, M. Sippel, G. Gold, J. Ringel, D. Weiß, K. Helmreich, M. Ankenbrand and J. Franke, "Substituting bond wires by additively manufactured interconnections", in Proceedings of the German Microwave Conference, 2018.
  • K. Lomakin, G. Gold and K. Helmreich, "Analytical Waveguide Model Precisely Predicting Loss and Delay Including Surface Roughness", IEEE Transactions on Microwave Theory and Techniques, 2018.
  • K. Lomakin, M. Sippel, G. Gold, J. Fröhlich, K. Helmreich, M. Ankenbrand and J. Franke, "Low reflective aerosol Jet printed broadband matched load up to 67 GHz", in Proceedings of the German Microwave Conference, 2018.
  • K. Lomakin, T. Pavlenko, M. Sippel, G. Gold, K. Helmreich, M. Ankenbrand, N. Urban and A. Franke, "Impact of Surface Roughness on 3D printed SLS Horn Antennas", in Proceedings of the European Conference on Antennas and Propagation (EUCAP), 2018.
  • M. Ankenbrand, M. Scheetz, J. Franke, K. Lomakin, M. Sippel, G. Gold and K. Helmreich, "Generation of 3D Functional Structures for High- Frequency Applications by Printing Technologies", in Proceedings of the 2018 13th International Congress Molded Interconnect Devices (MID), 2018.
  • K. Lomakin et al., "Evaluation and Characterization of 3D Printed Pyramid Horn Antennas utilizing different Deposition Techniques for Conductive Material", IEEE Transactions on Components, Packaging and Manufacturing Technology, pp. 1-1, 2018.
  • M. Ankenbrand, J. Franke, K. Lomakin, T. Pavlenko, M. Sippel, G. Gold, T. Weidner, D. Weiß and K. Helmreich, "Erzeugung von 3D-Funktionsstrukturen fuer Hochfrequenzanwendungen durch Druckverfahren", PLUS - Produktion von Leiterplatten und Systemen, 2018.
  • K. Lomakin, M. Sippel, G. Gold, P. Rochholz, K. Helmreich, M. Ankenbrand, D. Gräf and J. Franke, "Additive Fertigung in der Hochfrequenztechnik – Potenziale und Herausforderungen", PLUS - Produktion von Leiterplatten und Systemen, 2017.
  • K. Lomakin, G. Gold and K. Helmreich, "Transmission Line Model for Rectangular Waveguides accurately incorporating Loss Effects", in Proceedings of the 21st IEEE Workshop on Signal and Power Integrity (SPI 2017), Baveno, IT, 2017.
  • G. Gold and K. Helmreich, "A Physical Surface Roughness Model and Its Applications", IEEE Transactions on Microwave Theory and Techniques, 2017.
  • M. Sippel, K. Lomakin, G. Gold, T. Reitberger, S. Neermann and K. Helmreich, "Simple Approach for brief RF Characterization of thin 3D printable Dielectrics", in Proceedings of the 21st IEEE Workshop on Signal and Power Integrity (SPI 2017), Baveno, IT, 2017.
  • G. Gold and K. Helmreich, "Modeling Conductor Surface Roughness", in Proceedings of the IMS 2017 Workshop on New Developments in Microwave Measurements for Planar Circuits and Components, Honolulu, US, 2017.
  • F. Distler, G. Gold, K. Thurn, J. Schür and M. Vossiek, "Crosstalk Simulation of Multiple Insulated Twisted Pairs based on Transmission Line Theory", in Proceedings of the 21st IEEE Workshop on Signal and Power Integrity (SPI 2017), 2017.
  • M. Sippel, K. Lomakin, G. Gold and K. Helmreich, "Characteristics of Anisotropic Conducting Polymers Suggest Feasibility of Test Fixtures up to 110 GHz", Electronics, 2017.
  • A. Talai, G. Gold, M. Frank, S. Mann, R. Weigel and A. Kölpin, "A Coplanar Waveguide Resonator Based In-Line Material Characterization Sensor for Bulk and Metallized Dielectrics", Frequenz, vol. 71, no. 3-4, pp. 173–183, Dezember, 2016.
  • G. Gold and K. Helmreich, "Modeling of Transmission Lines with Multiple Coated Conductors", in Proceedings of the 46th European Microwave Week, London, Oktober, 2016.
  • G. Gold, "Modeling Surface Roughness in CST Microwave Studio", in Proceedings of the Computer Simulation Technology - European User Conference (EUC), Strasbourg, April, 2016.
  • M. Sippel, G. Gold and K. Helmreich, "Signal propagation properties of anisotropic conducting polymers up to 110 GHz and their applicability in test fixtures", in Proceedings of the 20th IEEE Workshop on Signal and Power Integrity, SPI 2016, 2016.
  • K. Helmreich and G. Gold, "Erzeugung von 3D-Funktionsstrukturen für Hochfrequenzanwendungen durch Druckverfahren", PLUS - Produktion von Leiterplatten und Systemen, no. 12, pp. 2417-2419, 2016.
  • G. Gold, "Modellierung rauher Oberflächen und Materialcharakterisierung für den Entwurf von Leiterplatten für Hochfrequenzanwendungen", pp. 144, 2016.
  • G. Gold and K. Helmreich, "Surface Impedance Concept for Modeling Conductor Roughness", in Proceedings of the Proceedings of the IEEE MTT-S International Microwave Symposium 2015 (IMS 2015), pp. 1-4, Phoenix, Arizona, USA, 2015.
  • G. Gold and K. Helmreich, "Measuring Design-DK and True Permittivity of PCB Materials up to 20 GHz", in Proceedings of the Proceedings of the 9th German Microwave Conference (GeMiC2015), pp. 154-157, Nuremberg, Germany, 2015.
  • G. Gold and K. Helmreich, "Effective Conductivity Concept for Modelling Conductor Surface Roughness", in Proceedings of the Proceedings, Santa Clara (CA), USA, 2014.
  • G. Gold and K. Helmreich, "PCBs for Microwave Applications up to 40 GHz and Beyond: Material Characterization, Surface Roughness Consideration, Modeling and Design Perspectives", in Proceedings of the Workshop Proceedings W32: PCB Design up to 67 GHz, pp. W32-2, Nürnberg, 2013.
  • G. Gold and K. Helmreich, "PCB Design up to 67 GHz (W32) - PCBs for Microwave Applications up to 40 GHz and Beyond: Material Characterization, Surface Roughness Consideration, Modeling and Design Perspectives", in Proceedings of the 43th European Microwave Week, Nuremberg, Germany, 2013.
  • G. Gold and K. Helmreich, "Measuring Dielectric Properties of PCB Material in the Two-Digit GHz-Range", in Proceedings of the Abstract Book, pp. 34-36, Chemnitz, 2013.
  • G. Gold and K. Helmreich, "A physical model for skin effect in rough surfaces", in Proceedings of the 42th European Microwave Week, Amsterdam, November, 2012.
Friedrich-Alexander-Universität Erlangen-Nürnberg