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Microwave Test Interfacing and Automation

Correct and high quality functionality of interconnects and substrate integrated passive systems on PCB depend on the concrete geometry realized by photolithography processes. However, with increasing operating frequencies and number of utilized signal layers, on the one hand, acceptable tolerances decrease dramatically. On the other hand, inner layers are not simply accessible for optical control.
Therefore, microwave test systems are an almost inevitable approach to reduce the total production cost of PCB systems.

Contact:

Prof. Dr.-Ing. Klaus Helmreich

Dr.-Ing. Gerald Gold, Akad. Rat

  • Tätigkeit: Microwave Assembly and Interconnects
  • Telefonnummer: +49 9131 85-65178
  • E-Mail: gerald.gold@fau.de