Helmreich, Klaus

Prof. Dr.-Ing. Klaus Helmreich

Department of Electrical-Electronic-Communication Engineering
Professur für Rechnergestützten Schaltungsentwurf (Prof. Dr. Helmreich)

Raum 05.232
Cauerstr. 9
91058 Erlangen

Phone number: +49 9131 85-20740
Email: klaus.helmreich@fau.de

Positionen und Funktionen

Fakultätsausschuss zur Verwendung der Studienzuschüsse: Vertreter der Stuko EEI
Fakultätsunterausschuss zur Verwendung der Studienzuschüsse Department EEI: Vorsitz / EEI / ET
Studienkommission BPT (Berufspädagogik Technik): Hochschullehrer/-innen
Studienkommission EEI: Professorinnen und Professoren
Zugangskommission Master Berufspädagogik Technik: Vorsitz

Vita

Klaus Helmreich received the Diploma degree in physics focused on test and failure analysis of integrated circuits and Dr. Eng. degree from Friedrich-Alexander University Erlangen-Nu ̈rnberg (FAU), Erlangen, Germany, in 1993. He was with industry as a Technology Specialist, where he was involved in mixed-signal test, device interfacing, and signal integrity characterization. Since 2004, he has been a Professor with the Institute of Microwaves and Photonics, FAU. His current research interests include signal integrity, material characterization, and test

Neueste Veröffentlichungen

Lomakin K., Sippel M., Helmreich K., Gold G.:
3D Printed Slotted Waveguide Array Antenna for D-Band Applications
2021 15th European Conference on Antennas and Propagation (EuCAP) (Düsseldorf, 22. March 2021 - 26. March 2021)
In: 2021 15th European Conference on Antennas and Propagation (EuCAP) 2021
DOI: 10.23919/EuCAP51087.2021.9410911
Lomakin K., Wang L., Job A., Süß-Wolf R., Franke J., Helmreich K., Gold G.:
Additive Manufacturing of Coplanar Transmission Lines on Alumina Substrate up to 24 GHz using Laser Assisted Selective Metallization
50th European Microwave Week (Utrecht, 12. January 2021 - 14. January 2021)
In: 2020 50th European Microwave Conference (EuMC) 2021
DOI: 10.23919/EuMC48046.2021.9338152
Klein L., Lomakin K., Sippel M., Helmreich K., Gold G.:
Additively Manufactured Six-Port for mmWave Applications
50th European Microwave Week (Utrecht, 12. January 2021 - 14. January 2021)
In: 2020 50th European Microwave Conference (EuMC) 2021
DOI: 10.23919/EuMC48046.2021.9338044
Lomakin K., Klein L., Sippel M., Helmreich K., Gold G.:
3D-Printed 3 dB Hybrid Coupler for D-Band Applications
50th European Microwave Week (Utrecht, 12. January 2021 - 14. January 2021)
In: 2020 50th European Microwave Conference (EuMC) 2021
DOI: 10.23919/EuMC48046.2021.9337997
Lomakin K., Sippel M., Helmreich K., Gold G.:
Design and Analysis of 3D Printed Slotted Waveguides for D-Band using Stereolithography and Electroless Silver Plating
International Microwave Symposium (Los Angeles, CA, 21. June 2020 - 26. June 2020)
In: 2020 IEEE/MTT-S International Microwave Symposium (IMS) 2020
DOI: 10.1109/IMS30576.2020.9223819
Lomakin K., Helmreich K., Gold G.:
Using Group Velocity for Correct Determination of Phase Coefficient Without Initial Phase Assumption
24th Workshop on Signal and Power Integrity (Cologne, 17. May 2020 - 20. May 2020)
In: 2020 IEEE 24th Workshop on Signal and Power Integrity (SPI) 2020
DOI: 10.1109/SPI48784.2020.9218183
Ullmann I., Root K., Lomakin K., Gold G., Gottinger M., Helmreich K., Vossiek M.:
Circular Polarization Millimeter-Wave SAR Imaging using 3D-Printed Helix Antennas
SPIE Security + Defense Forum (Edingburgh)
DOI: 10.1117/12.2573952
Lomakin K., Sippel M., Ullmann I., Helmreich K., Gold G.:
3D Printed Helix Antenna for 77 GHz
14th European Conference on Antennas and Propagation (Copenhagen, Denkmark, 15. March 2020 - 20. March 2020)
In: 2020 14th European Conference on Antennas and Propagation (EuCAP) 2020
DOI: 10.23919/EuCAP48036.2020.9135996
Lomakin K., Herold S., Ringel L., Ringel J., Simon D., Sippel M., Sion A., Vossiek M., Helmreich K., Gold G.:
SLA Printed 3D Waveguide Paths for E-Band using Electroless Silver Plating
In: IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (2019), p. 2476-2481
ISSN: 2156-3950
DOI: 10.1109/TCPMT.2019.2927671
Lomakin K., Guschlbauer R., Osmanlic F., Fu Z., Sippel M., Helmreich K., Körner C., Vossiek M., Gold G.:
3D Printed Copper Waveguides by Selective Electron Beam Melting Process for E-Band
EuMW 2019 (Paris)
DOI: 10.23919/EuMC.2019.8910893
Sippel M., Lomakin K., Ankenbrand M., Petersen M., Franke J., Helmreich K., Vossiek M., Gold G.:
3D-Printed Bowtie Filter Created by High Precision NanoJet System Combined with Novel Printing Strategy
28th Conference on Electrical Performance of Electronic Packages and Systems (EPEPS 2019) (Montreal)
DOI: 10.1109/EPEPS47316.2019.193232
Distler F., Sippel M., Schür J., Gold G., Helmreich K., Vossiek M.:
Additively Manufactured Dielectric Waveguides for Advanced Concepts for Millimeter-Wave Interconnects
In: IEEE Transactions on Microwave Theory and Techniques 67 (2019), p. 4298-4307
ISSN: 0018-9480
DOI: 10.1109/TMTT.2019.2939831
Lomakin K., Klein L., Ringel L., Ringel J., Sippel M., Helmreich K., Gold G.:
3D Printed E-Band Hybrid Coupler
In: IEEE Microwave and Wireless Components Letters 29 (2019), p. 580-582
ISSN: 1531-1309
DOI: 10.1109/LMWC.2019.2931458
Lau I., Hajian A., Michler F., Gold G., Lurz F., Schmid U., Helmreich K., Weigel R., Kölpin A.:
Influence of the PCB Manufacturing Process on the Measurement Error of Planar Relative Permittivity Sensors Up To 100 GHz
In: IEEE Transactions on Microwave Theory and Techniques 67 (2019), p. 2793-2804
ISSN: 0018-9480
DOI: 10.1109/TMTT.2019.2910114
URL: https://ieeexplore.ieee.org/document/8698275
Lomakin K., Herold S., Simon D., Sippel M., Sion A., Vossiek M., Helmreich K., Gold G.:
3D Printed Slotted Rectangular Hollow Waveguides
IEEE MTT-S International Microwave Symposium, Boston, USA, Juni, 2019. (Boston, MA)
DOI: 10.1109/MWSYM.2019.8700864
Arz U., Probst T., Kuhlmann K., Ridler N., Shang X., Mubarak F., Hoffmann J., Wollensack M., Zeier M., Phung GN., Heinrich W., Lomakin K., Gold G., Helmreich K., Lozar R., Dambrine G., Haddadi K., Spirito M., Clarke R. (ed.):
Best Practice Guide for Planar S-Parameter Measurements using Vector Network Analysers : EMPIR - 14IND02 PlanarCal
2019
DOI: 10.7795/530.20190424B
Gold G., Lomakin K., Helmreich K., Arz U.:
High-Frequency Modeling of Coplanar Waveguides Including Surface Roughness
In: Advances in Radio Science (2019)
ISSN: 1684-9965
DOI: 10.5194/ars-17-51-2019
Lomakin K., Ankenbrand M., Sippel M., Franke J., Helmreich K., Gold G.:
Nanojet 3D Printed Coplanar Waveguides on Flexible Polyimide Substrate up to 24 GHz
1st IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS 2019) (Glasgow, 7. July 2019 - 10. July 2019)
Köppel M., Deckelmann M., Sippel M., Lomakin K., Werzinger S., Gold G., Helmreich K., Schmauß B.:
Using coherent optical frequency domain reflectometry to assist the additive manufacturing process of structures for radio frequency applications
In: SPIE Optics + Photonics: Optical Engineering + Applications 2018
Lomakin K., Sippel M., Gold G., Ringel J., Weiß D., Helmreich K., Ankenbrand M., Franke J.:
Substituting bond wires by additively manufactured interconnections
In: German Microwave Conference 2018
DOI: 10.23919/gemic.2018.8335106
Lomakin K., Sippel M., Gold G., Fröhlich J., Helmreich K., Ankenbrand M., Franke J.:
Low reflective aerosol Jet printed broadband matched load up to 67 GHz
In: German Microwave Conference 2018
DOI: 10.23919/gemic.2018.8335109
Lomakin K., Pavlenko T., Sippel M., Gold G., Helmreich K., Ankenbrand M., Urban N., Franke A.:
Impact of Surface Roughness on 3D printed SLS Horn Antennas
In: European Conference on Antennas and Propagation (EUCAP) 2018
DOI: 10.1049/cp.2018.1235
Ankenbrand M., Scheetz M., Franke J., Lomakin K., Sippel M., Gold G., Helmreich K.:
Generation of 3D Functional Structures for High- Frequency Applications by Printing Technologies
2018 13th International Congress Molded Interconnect Devices (MID)
DOI: 10.1109/ICMID.2018.8527052
Lomakin K., Pavlenko T., Ankenbrand M., Sippel M., Ringel J., Scheetz M., Klemm T., Gräf D., Helmreich K., Franke J., Gold G.:
Evaluation and Characterization of 3D Printed Pyramid Horn Antennas utilizing different Deposition Techniques for Conductive Material
In: IEEE Transactions on Components, Packaging and Manufacturing Technology (2018), p. 1-1
ISSN: 2156-3950
DOI: 10.1109/tcpmt.2018.2871931
Ankenbrand M., Franke J., Lomakin K., Pavlenko T., Sippel M., Gold G., Weidner T., Weiß D., Helmreich K.:
Erzeugung von 3D-Funktionsstrukturen fuer Hochfrequenzanwendungen durch Druckverfahren
In: PLUS - Produktion von Leiterplatten und Systemen (2018)
Lomakin K., Gold G., Helmreich K.:
Analytical Waveguide Model Precisely Predicting Loss and Delay Including Surface Roughness
In: IEEE Transactions on Microwave Theory and Techniques (2018)
ISSN: 0018-9480
DOI: 10.1109/tmtt.2018.2827383
Lomakin K., Simon D., Sippel M., Gold G., Helmreich K., Seler E., Tong Z., Reuter R.:
3D Printed Slotted Waveguide Array Antenna for Automotive Radar Applications in W-Band
In: 48th European Microwave Conference (EuMW 2018) 2018
DOI: 10.23919/EuMC.2018.8541536
Lomakin K., Pavlenko T., Sippel M., Gold G., Weidner T., Helmreich K., Ankenbrand M., Franke J.:
3D Printed Helix Antenna
In: European Conference on Antennas and Propagation (EUCAP) 2018
DOI: 10.1049/cp.2018.1034
Lomakin K., Gold G., Helmreich K.:
Transmission Line Model for Rectangular Waveguides accurately incorporating Loss Effects
In: 21st IEEE Workshop on Signal and Power Integrity (SPI 2017) 2017
DOI: 10.1109/SaPIW.2017.7944024
Sippel M., Lomakin K., Gold G., Reitberger T., Neermann S., Helmreich K.:
Simple Approach for brief RF Characterization of thin 3D printable Dielectrics
In: 21st IEEE Workshop on Signal and Power Integrity (SPI 2017) 2017
DOI: 10.1109/SaPIW.2017.7944043
Gold G., Helmreich K.:
Modeling Conductor Surface Roughness
In: IMS 2017 Workshop on New Developments in Microwave Measurements for Planar Circuits and Components 2017
Sippel M., Lomakin K., Gold G., Helmreich K.:
Characteristics of Anisotropic Conducting Polymers Suggest Feasibility of Test Fixtures up to 110 GHz
In: Electronics (2017)
ISSN: 0013-5070
DOI: 10.3390/electronics6040109
Gold G., Helmreich K.:
A Physical Surface Roughness Model and Its Applications
In: IEEE Transactions on Microwave Theory and Techniques (2017)
ISSN: 0018-9480
DOI: 10.1109/TMTT.2017.2695192
Lomakin K., Sippel M., Gold G., Rochholz P., Helmreich K., Ankenbrand M., Gräf D., Franke J.:
Additive Fertigung in der Hochfrequenztechnik – Potenziale und Herausforderungen
In: PLUS - Produktion von Leiterplatten und Systemen (2017)
Gold G., Helmreich K.:
Modeling of Transmission Lines with Multiple Coated Conductors
46th European Microwave Week (London)
DOI: 10.1109/EuMC.2016.7824423
Sippel M., Gold G., Helmreich K.:
Signal propagation properties of anisotropic conducting polymers up to 110 GHz and their applicability in test fixtures
20th IEEE Workshop on Signal and Power Integrity, SPI 2016
DOI: 10.1109/SaPIW.2016.7496290
Helmreich K., Gold G.:
Erzeugung von 3D-Funktionsstrukturen für Hochfrequenzanwendungen durch Druckverfahren
In: PLUS - Produktion von Leiterplatten und Systemen (2016), p. 2417-2419
Gold G., Helmreich K.:
Surface Impedance Concept for Modeling Conductor Roughness
IEEE MTT-S International Microwave Symposium 2015 (IMS 2015) (Phoenix, Arizona, USA)
In: Proceedings of the IEEE MTT-S International Microwave Symposium 2015 (IMS 2015) 2015
DOI: 10.1109/MWSYM.2015.7167013
Gold G., Helmreich K.:
Measuring Design-DK and True Permittivity of PCB Materials up to 20 GHz
German Microwave Conference (Nuremberg, Germany)
In: Proceedings of the 9th German Microwave Conference (GeMiC2015) 2015
Gold G., Helmreich K.:
Effective Conductivity Concept for Modelling Conductor Surface Roughness
DesignCon 2014 (Santa Clara (CA), USA, 28. January 2014 - 31. January 2014)
In: Proceedings 2014
Gold G., Helmreich K.:
PCBs for Microwave Applications up to 40 GHz and Beyond: Material Characterization, Surface Roughness Consideration, Modeling and Design Perspectives
European Microwave Week (Nürnberg)
In: Workshop Proceedings W32: PCB Design up to 67 GHz 2013
Gold G., Helmreich K.:
PCB Design up to 67 GHz (W32) - PCBs for Microwave Applications up to 40 GHz and Beyond: Material Characterization, Surface Roughness Consideration, Modeling and Design Perspectives
In: 43th European Microwave Week 2013
Gold G., Helmreich K.:
Measuring Dielectric Properties of PCB Material in the Two-Digit GHz-Range
International Workshop on Impedance Spectroscopy (IWIS 2013) (Chemnitz)
In: Abstract Book 2013
Gold G., Helmreich K.:
A physical model for skin effect in rough surfaces
42th European Microwave Week (Amsterdam)
DOI: 10.23919/EuMC.2012.6459235
Helmreich K.:
Measuring Signal Integrity
In: IEEE Microwave Magazine 12 (2011), p. 75-82
ISSN: 1527-3342
DOI: 10.1109/MMM.2011.941415
Glaser D., Müller A., Lu P., Uygur G., Helmreich K.:
Standardized Characterisation of Device Power Supplies for Automated Test Generation and Simulation
11. GMM/ITG Fachtagung "ANALOG" (Erfurt)
In: Tagungsband, Berlin, Offenbach: 2010
Glaser D., Lu P., Helmreich K.:
Vollständige Integration des virtuellen Tests in den Entwurfsprozess integrierter Schaltungen
21. ITG/GI/GMM Workshop "Testmethoden und Zuverlässigkeit von Schaltungen und Systemen" (Bremen)
In: Tagungsband 2009
Lu P., Glaser D., Uygur G., Helmreich K.:
The Best of Both Worlds: Merging the Benefits of Rack&Stack and Universal ATE
International Test Conference 2009 (Austin, Texas, 1. November 2009 - 6. November 2009)
In: Conference Proceedings 2009
DOI: 10.1109/TEST.2009.5355593
Uygur G., Lu P., Glaser D., Weichselgartner S., Helmreich K., Sattler S., Lechner A., Brenneke A.:
Optimales, skalierbares Ressourcenmanagement für modulare, gemischt analog-digitale Testsysteme
GMM/GI/ITG-Fachtagung Zuverlässigkeit und Entwurf (ZuE)" (Stuttgart)
In: Tagungsband, Berlin, Offenbach: 2009
Lu P., Glaser D., Uygur G., Weichselgartner S., Helmreich K., Lechner A.:
Mixed-Signal Test Development using Open Standard Modeling and Description Languages
2009 IEEE International Behavioral Modeling and Simulation Conference (BMAS) (San Jose, California, 17. September 2009 - 18. September 2009)
In: Proceedings 2009
DOI: 10.1109/BMAS.2009.5338885
Lu P., Glaser D., Weichslgartner S., Uygur G., Helmreich K., Lechner A.:
Bridge the Gap between Simulation and Test: An OSA-Compliant Virtual Test Environment
AUTOTESTCON 2009 (Anaheim, California, 14. September 2009 - 17. September 2009)
In: Proceedings 2009
DOI: 10.1109/AUTEST.2009.5314059
Lu P., Glaser D., Uygur G., Helmreich K.:
A Novel Approach to Entirely Integrate Virtual Test into Test Development Flow
DATE'09 - Design, Automation & Test in Europe (Nice, France, 20. April 2009 - 24. April 2009)
In: Proceedings 2009
Lu P., Helmreich K.:
Standards-Based Construction of a Virtual Test Environment
20. ITG/GI/GMM Workshop "Testmethoden und Zuverlässigkeit von Schaltungen und Systemen" (Wien)
In: Tagungsband 2008
Helmreich K.:
Signal Integrity: From Signal Path Analysis to Application Performance Prediction
International Microwave Symposium (Atlanta)
In: Tutorial TMB Demystifying Microwave Signal Integrity - High Speed Design & Measurement 2008
Helmreich K., Uygur G.:
Automatischer Abgleich von Leistungskopplern
Zuverlässigkeit und Entwurf (Ingolstadt)
In: Tagungsband, Berlin, Offenbach: 2008
Helmreich K.:
Präzise Prüfung von Leitungswellenwiderstand und Signalintegrität an Leiterplatten
DESIGN&ELEKTRONIK-Entwicklerforum 2006 (München)
In: Kostengünstige Entwicklung und Fertigung komplexer Leiterplatten 2006
Helmreich K.:
A Multiple Domain Characterisation and Test Method for Discontinous Signal Paths
10th IEEE Workshop on Signal Propagation on Interconnects (Berlin)
In: Proceedings 2006
DOI: 10.1109/SPI.2006.289152