Sippel, Mark

Mark Sippel, M. Sc.

Department of Electrical-Electronic-Communication Engineering
Institute of Microwaves and Photonics (LHFT)

Raum 01.038
Konrad-Zuse-Straße 3
91052 Erlangen

Phone number: +49 9131 85-23316
Fax number: +49 9131 85-27212
Email: mark.sippel@fau.de
Website: http://lhft.de/mitarbeiter/data/mark-sippel.shtml

Publications

Hofmann A., Klein L., Lomakin K., Sippel M., Gold G.:
Additively Manufactured WR15 Waveguide to Microstrip Transition for Broadband V-Band Applications
European Microwave Conference (EuMC) (Milan, Italy)
Hofmann A., Lomakin K., Sippel M., Gold G.:
Additively Manufactured Slotted Waveguides for THz Applications
International Microwave Symposium (IMS) (Denver, CO)
In: IEEE/MTT-S International Microwave Symposium (IMS) 2022
Hofmann A., Lomakin K., Sippel M., Gold G.:
Additively Manufactured Broadwall Waveguide Couplers for V-Band Applications
German Microwave Conference (GeMIC) (Ulm)
In: German Microwave Conference 2022
Hubert F., Bader T., Wahl L., Hofmann A., Lomakin K., Sippel M., Travitzky N., Gold G.:
Additive Manufactured Waveguide for E-Band Using Ceramic Materials
In: Applied Sciences 12 (2021), Article No.: 212
ISSN: 2076-3417
DOI: 10.3390/app12010212
URL: https://www.mdpi.com/2076-3417/12/1/212
Tesmer H., Gold G., Bachbauer F., Polat E., Sippel M., Jakoby R., Vossiek M., Maune H.:
Feasibility of Additively Manufactured Tunable Liquid Crystal Loaded Dielectric Waveguides
In: IEEE Microwave and Wireless Components Letters (2021), p. 1-1
ISSN: 1531-1309
DOI: 10.1109/LMWC.2021.3082700
Lomakin K., Sippel M., Helmreich K., Gold G.:
3D Printed Slotted Waveguide Array Antenna for D-Band Applications
2021 15th European Conference on Antennas and Propagation (EuCAP) (Düsseldorf, 22. March 2021 - 26. March 2021)
In: 2021 15th European Conference on Antennas and Propagation (EuCAP) 2021
DOI: 10.23919/EuCAP51087.2021.9410911
Neermann S., Franke J., Sippel M., Lomakin K., Gold G.:
RF Characterization of the Homogeneity of Sintered Micro- And Nanoparticle Silver Inks for Printed Electronics
14th International Congress Molded Interconnect Devices, MID 2021 (, 8. February 2021 - 11. February 2021)
In: 2021 14th International Congress: Molded Interconnect Devices, MID 2021 - Proceedings 2021
DOI: 10.1109/MID50463.2021.9361629
Klein L., Lomakin K., Sippel M., Helmreich K., Gold G.:
Additively Manufactured Six-Port for mmWave Applications
50th European Microwave Week (Utrecht, 12. January 2021 - 14. January 2021)
In: 2020 50th European Microwave Conference (EuMC) 2021
DOI: 10.23919/EuMC48046.2021.9338044
Lomakin K., Klein L., Sippel M., Helmreich K., Gold G.:
3D-Printed 3 dB Hybrid Coupler for D-Band Applications
50th European Microwave Week (Utrecht, 12. January 2021 - 14. January 2021)
In: 2020 50th European Microwave Conference (EuMC) 2021
DOI: 10.23919/EuMC48046.2021.9337997
Neermann S., Franke J., Sippel M., Lomakin K., Gold G.:
Reliability of Printed Microwave Electronics
IEEE 71st Electronic Components and Technology Conference (ECTC) (, ELECTR NETWORK)
In: IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021), LOS ALAMITOS: 2021
DOI: 10.1109/ECTC32696.2021.00283
Lomakin K., Sippel M., Helmreich K., Gold G.:
Design and Analysis of 3D Printed Slotted Waveguides for D-Band using Stereolithography and Electroless Silver Plating
International Microwave Symposium (Los Angeles, CA, 21. June 2020 - 26. June 2020)
In: 2020 IEEE/MTT-S International Microwave Symposium (IMS) 2020
DOI: 10.1109/IMS30576.2020.9223819
Lomakin K., Sippel M., Ullmann I., Helmreich K., Gold G.:
3D Printed Helix Antenna for 77 GHz
14th European Conference on Antennas and Propagation (Copenhagen, Denkmark, 15. March 2020 - 20. March 2020)
In: 2020 14th European Conference on Antennas and Propagation (EuCAP) 2020
DOI: 10.23919/EuCAP48036.2020.9135996
Lomakin K., Herold S., Ringel L., Ringel J., Simon D., Sippel M., Sion A., Vossiek M., Helmreich K., Gold G.:
SLA Printed 3D Waveguide Paths for E-Band using Electroless Silver Plating
In: IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (2019), p. 2476-2481
ISSN: 2156-3950
DOI: 10.1109/TCPMT.2019.2927671
Lomakin K., Guschlbauer R., Osmanlic F., Fu Z., Sippel M., Helmreich K., Körner C., Vossiek M., Gold G.:
3D Printed Copper Waveguides by Selective Electron Beam Melting Process for E-Band
EuMW 2019 (Paris)
DOI: 10.23919/EuMC.2019.8910893
Sippel M., Lomakin K., Ankenbrand M., Petersen M., Franke J., Helmreich K., Vossiek M., Gold G.:
3D-Printed Bowtie Filter Created by High Precision NanoJet System Combined with Novel Printing Strategy
28th Conference on Electrical Performance of Electronic Packages and Systems (EPEPS 2019) (Montreal)
DOI: 10.1109/EPEPS47316.2019.193232
Distler F., Sippel M., Schür J., Gold G., Helmreich K., Vossiek M.:
Additively Manufactured Dielectric Waveguides for Advanced Concepts for Millimeter-Wave Interconnects
In: IEEE Transactions on Microwave Theory and Techniques 67 (2019), p. 4298-4307
ISSN: 0018-9480
DOI: 10.1109/TMTT.2019.2939831
Lomakin K., Klein L., Ringel L., Ringel J., Sippel M., Helmreich K., Gold G.:
3D Printed E-Band Hybrid Coupler
In: IEEE Microwave and Wireless Components Letters 29 (2019), p. 580-582
ISSN: 1531-1309
DOI: 10.1109/LMWC.2019.2931458
Lomakin K., Herold S., Simon D., Sippel M., Sion A., Vossiek M., Helmreich K., Gold G.:
3D Printed Slotted Rectangular Hollow Waveguides
IEEE MTT-S International Microwave Symposium, Boston, USA, Juni, 2019. (Boston, MA)
DOI: 10.1109/MWSYM.2019.8700864
Lomakin K., Ankenbrand M., Sippel M., Franke J., Helmreich K., Gold G.:
Nanojet 3D Printed Coplanar Waveguides on Flexible Polyimide Substrate up to 24 GHz
1st IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS 2019) (Glasgow, 7. July 2019 - 10. July 2019)
Köppel M., Deckelmann M., Sippel M., Lomakin K., Werzinger S., Gold G., Helmreich K., Schmauß B.:
Using coherent optical frequency domain reflectometry to assist the additive manufacturing process of structures for radio frequency applications
In: SPIE Optics + Photonics: Optical Engineering + Applications 2018
Lomakin K., Sippel M., Gold G., Ringel J., Weiß D., Helmreich K., Ankenbrand M., Franke J.:
Substituting bond wires by additively manufactured interconnections
In: German Microwave Conference 2018
DOI: 10.23919/gemic.2018.8335106
Lomakin K., Sippel M., Gold G., Fröhlich J., Helmreich K., Ankenbrand M., Franke J.:
Low reflective aerosol Jet printed broadband matched load up to 67 GHz
In: German Microwave Conference 2018
DOI: 10.23919/gemic.2018.8335109
Lomakin K., Pavlenko T., Sippel M., Gold G., Helmreich K., Ankenbrand M., Urban N., Franke A.:
Impact of Surface Roughness on 3D printed SLS Horn Antennas
In: European Conference on Antennas and Propagation (EUCAP) 2018
DOI: 10.1049/cp.2018.1235
Ankenbrand M., Scheetz M., Franke J., Lomakin K., Sippel M., Gold G., Helmreich K.:
Generation of 3D Functional Structures for High- Frequency Applications by Printing Technologies
2018 13th International Congress Molded Interconnect Devices (MID)
DOI: 10.1109/ICMID.2018.8527052
Lomakin K., Pavlenko T., Ankenbrand M., Sippel M., Ringel J., Scheetz M., Klemm T., Gräf D., Helmreich K., Franke J., Gold G.:
Evaluation and Characterization of 3D Printed Pyramid Horn Antennas utilizing different Deposition Techniques for Conductive Material
In: IEEE Transactions on Components, Packaging and Manufacturing Technology (2018), p. 1-1
ISSN: 2156-3950
DOI: 10.1109/tcpmt.2018.2871931
Ankenbrand M., Franke J., Lomakin K., Pavlenko T., Sippel M., Gold G., Weidner T., Weiß D., Helmreich K.:
Erzeugung von 3D-Funktionsstrukturen fuer Hochfrequenzanwendungen durch Druckverfahren
In: PLUS - Produktion von Leiterplatten und Systemen (2018)
Lomakin K., Simon D., Sippel M., Gold G., Helmreich K., Seler E., Tong Z., Reuter R.:
3D Printed Slotted Waveguide Array Antenna for Automotive Radar Applications in W-Band
In: 48th European Microwave Conference (EuMW 2018) 2018
DOI: 10.23919/EuMC.2018.8541536
Lomakin K., Pavlenko T., Sippel M., Gold G., Weidner T., Helmreich K., Ankenbrand M., Franke J.:
3D Printed Helix Antenna
In: European Conference on Antennas and Propagation (EUCAP) 2018
DOI: 10.1049/cp.2018.1034
Sippel M., Lomakin K., Gold G., Reitberger T., Neermann S., Helmreich K.:
Simple Approach for brief RF Characterization of thin 3D printable Dielectrics
In: 21st IEEE Workshop on Signal and Power Integrity (SPI 2017) 2017
DOI: 10.1109/SaPIW.2017.7944043
Sippel M., Lomakin K., Gold G., Helmreich K.:
Characteristics of Anisotropic Conducting Polymers Suggest Feasibility of Test Fixtures up to 110 GHz
In: Electronics (2017)
ISSN: 0013-5070
DOI: 10.3390/electronics6040109
Lomakin K., Sippel M., Gold G., Rochholz P., Helmreich K., Ankenbrand M., Gräf D., Franke J.:
Additive Fertigung in der Hochfrequenztechnik – Potenziale und Herausforderungen
In: PLUS - Produktion von Leiterplatten und Systemen (2017)
Sippel M., Gold G., Helmreich K.:
Signal propagation properties of anisotropic conducting polymers up to 110 GHz and their applicability in test fixtures
20th IEEE Workshop on Signal and Power Integrity, SPI 2016
DOI: 10.1109/SaPIW.2016.7496290