Ringel, Johannes

Johannes Ringel

Department Elektrotechnik-Elektronik-Informationstechnik (EEI)
Lehrstuhl für Hochfrequenztechnik

Room: Raum 05.228
Cauerstraße 9
91058 Erlangen


  • R. Bauer, J. Ringel, M. Koch, M. Laschke, A. Burkovski and M. Karl, "Design-Dependent Electrophysiological Effects of Electrolysis Electrodes Used for Endodontic Disinfection", Applied Sciences, vol. 14, no. 4, Februar, 2024.
    DOI: 10.3390/app14041445
  • K. Lomakin, S. Herold, L. Ringel, J. Ringel, D. Simon, M. Sippel, A. Sion, M. Vossiek, K. Helmreich and G. Gold, "SLA Printed 3D Waveguide Paths for E-Band using Electroless Silver Plating", IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 9, no. 12, pp. 2476-2481, Dezember, 2019.
    DOI: 10.1109/TCPMT.2019.2927671
  • K. Lomakin, L. Klein, L. Ringel, J. Ringel, M. Sippel, K. Helmreich and G. Gold, "3D Printed E-Band Hybrid Coupler", IEEE Microwave and Wireless Components Letters, vol. 29, no. 9, pp. 580-582, September, 2019.
    DOI: 10.1109/LMWC.2019.2931458
  • K. Lomakin, M. Sippel, G. Gold, J. Ringel, D. Weiß, K. Helmreich, M. Ankenbrand and J. Franke, "Substituting bond wires by additively manufactured interconnections", in Proceedings of the German Microwave Conference, 2018.
    DOI: 10.23919/gemic.2018.8335106
  • K. Lomakin, T. Pavlenko, M. Ankenbrand, M. Sippel, J. Ringel, M. Scheetz, T. Klemm, D. Gräf, K. Helmreich, J. Franke and G. Gold, "Evaluation and Characterization of 3D Printed Pyramid Horn Antennas utilizing different Deposition Techniques for Conductive Material", IEEE Transactions on Components, Packaging and Manufacturing Technology, pp. 1-1, 2018.
    DOI: 10.1109/tcpmt.2018.2871931
  • D. Oppelt, T. Pfahler, F. Distler, J. Ringel, O. Goertz and M. Vossiek, "Nearfield imaging probe for contactless assessment of burned skin", in Proceedings of the 13th European Radar Conference (EuRad), 2017.
    DOI: 10.23919/eurad.2017.8249180